Product Features

- Higher DC bias current with lower DC resistance using trench technology
- Ultra-thin, low-profile package for compact designs
- Integral structure for high reliability
- Excellent solderability and high temperature resistance
- Magnetic shielding structure, no cross coupling interference (No cross coupling)

Typical Applications

- DC-DC converter circuits for **mobile devices, wearable devices, digital video devices (DVCs), hard disk drives (HDDs)**, etc.