-
HMD JG Series
Product Features
- Low Height, Low DC Resistance (RDC), Ultra-High Current
- Molded magnetic material structure with high-density installation and extremely low noise characteristics
- Suitable for automatic labeling (providing tape packaging)
- Easy to reflow solder to confirm solder joint statusTypical Applications
- High Density DC/DC Converters
- POL Modular Power Supply
- High Current VRM/VRD (Laptop, Server, Desktop CPUs)
- High Speed Charger
- Ultra-thin devices (thickness <1.2mm): ultra-thin laptops, monitors, TVs, tablets, etc. -
HWI Series
Product Features
- A wide variety of high power inductors with excellent high saturation characteristics for surface mount applications.
Typical Applications
- Bluetooth power supply circuit
- OA office equipment
- notebook computer
- Portable communications equipment
- DC/DC Converters
- High-frequency circuits, etc. -
HTF Series
Product Features
- HTF Series is a multilayer power inductor with thin film process, featuring low AC loss, small size, and stable performance.
This series of products is particularly suitable for miniature power modules and portable electronic devices.Typical Applications
- Mini Power Module
- Bluetooth & True Wireless Headset (BT / TWS)
- smart wearable device (smartphone, tablet, etc)
- Power management system for mobile terminals -
HMG SH Series
Product Features
- Higher DC bias current with lower DC resistance using trench technology
- Ultra-thin, low-profile package for compact designs
- Integral structure for high reliability
- Excellent solderability and high temperature resistance
- Magnetic shielding structure, no cross coupling interference (No cross coupling)Typical Applications
- DC-DC converter circuits for **mobile devices, wearable devices, digital video devices (DVCs), hard disk drives (HDDs)**, etc.
Shopping Cart